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SHOULDER ELECTRONICS LIMITED
SAW Components Data Sheet
PRODUCT : MODEL NO : PREPARED : CHECKED : APPROVED : DATE : 2007-01-25 SAW FILTER HDF1086A SMD-7
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SHOULDER ELECTRONICS LIMITED
1. SCOPE
This specification shall cover the characteristics of SAW filter With F1086AS7 used digital television
2. ELECTRICAL SPECIFICATION
Dc voltage VDC> Operation temperature Storage temperature RF Power dissipation Electronic Characteristics 2-1.Typical frequency response 0V -40C~+85C -40C~+85C 0 dBm(source impedance 200)
2-2.Electrical characteristics Par number Norminal center frequency(Fo) Insertion loss: 500.00~Fc-85.00MHz Fc-98.00~-84.00MHz Fc-40.00~-50.00MHz Fc4.00MHz Fc+70.00~2000.00MHz Ripple (with Fo 4.0MHz) Input/Output Impedance HDF1086AS7 1086 50.0 min. 50.0 min 40.0 min 5.80 max. 50.0 min. 1.5 max. 200 Unit MHz
dB
dB ohm
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SHOULDER ELECTRONICS LIMITED
3. TEST CIRCUIT
4. DIMENSION
5. ENVIRONMENTAL CHARACTERISTICS
5-1 Temperature cycling Subject the device to a low temperature of -45for 30 minutes. Following by a high temperature of +25 for 5 Minutes and a higher temperature of +85 for 30 Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the measurement. It shall meet the specifications in table 1. 5-2 Resistance to solder heat Submerge the device terminals into the solder bath at 260 5 for 101 sec. Then release the device into the room conditions for 4 hours. It shall meet the specifications in table 1. 5-3 Solderability Submerge the device terminals into the solder bath at 245 5 for 5s, More than 95% area of the soldering pad must be covered with new solder. It shall meet the specifications in table 1. 5-4 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1 m 3 times.
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the filter shall fulfill the specifications in table 1. 5-5 Vibration Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in table 1.
6. REMARK
6.1 Static voltage Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage. 6.2 Ultrasonic cleaning Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid ultrasonic cleaning 6.3 Soldering Only leads of component may be soldered. Please avoid soldering another part of component.
7. Packing
7.1 Dimensions (1) Carrier Tape: Figure 1 (2) Reel: Figure 2 (3) The product shall be packed properly not to be damaged during transportation and storage. 7.2 Reeling Quantity 1000 pcs/reel 7'' 3000 pcs/reel 13'' 7.3 Taping Structure (1) The tape shall be wound around the reel in the direction shown below.
(2) Label
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SHOULDER ELECTRONICS LIMITED
Device Name User Product Name Quantity Lot No. (3) Leader part and vacant position specifications.
8. TAPE SPECIFICATIONS
8.1 Tensile Strength of Carrier Tape: 4.4N/mm width 8.2 Top Cover Tape Adhesion (See the below figure) (1) pull off angle: 0~15 (2) speed: 300mm/min. (3) force: 20~70g
[Figure 1] Carrier Tape Dimensions
[Unit:mm]
W 12.00 F 5.50 E 1.75 P0 4.00 P1 4.00 P2 2.00 D0 O1.50 Page: 5 D1 O1.5 t1 0.31 t2 1.30 A 3.4 B 3.4
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SHOULDER ELECTRONICS LIMITED
0.30 [Figure 2]
0.10
0.10
0.10
0.10
0.10
0.25
0.05
0.10
MAX.
MAX
[Unit:mm] A O330 1.0 B O100 0.5 C O13 0.5 D O21 0.8 E 2 0.5 W 13 0.3 t 3 max. r 1.0 max.
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SHOULDER ELECTRONICS LIMITED

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